Advanced Electronics Packaging Technologies in Cyber-Physical System

Advanced Technologies for Mobile IoT and Cyber-Physical Systems

Advanced packaging yields higher performance and reliability in power electronics

Power density of power electronics will continue to grow. It is always supported by progress in power semiconductors. Further significant loss reduction of IGBT and diodes becomes possible if power circuit design improves with respect to electro-dynamic performance. Efforts to improve cooling for better power dissipation out of smaller volumes appear to be disadvantageous in comparison to incre...

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500°C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-...

Medical Cyber Physical System

Cyber Physical System (CPS) is collection of different computation component which collaborate with each other in order to control the physical entity. Cyber physical system has a far reaching effect in different area such as aerospace, automotive, chemical processes, civil infrastructure, energy, healthcare, manufacturing, transportation, entertainment, and consumer appliances. CPS in healthca...

Parasitics in Power Electronics Packaging

In this paper we investigate the influence of 1st-level packaging components on the electromagnetic behaviour of power electronic modules. The main goal is to identify the critical layout paths and packaging components and to understand the mechanisms that affect the module performance. Several power electronics packaging technologies are compared on the basis of their electrical and electromag...